The "tread-head" SMT pin design is said to offer significant improvements in both alignment and pull strength compared to conventional SMT pin designs. The new pins are specifically designed to meet the rigorous requirements of applications such as dc power converter assemblies. In addition, the potential automation benefits of the new pin design can significantly increase production throughput. The pins use a unique pattern on the bottom surface of the pinhead, consisting of a round center reservoir with slots extending to the outside edges. This tread-head design facilitates out-grassing during reflow processing and creates a vacuum under the head, which actually pulls the pin tightly into proper alignment on the PCD pad. The low profile tread-head design also promotes solder wicking to consistently form compact high-strength solder fillets that require a minimal amount of PCB real estate.