EE Product News

SMT SIP Package Developed For Hybrids

product pic

Designed to maintain the single in-line pin (SIP) package’s space-saving vertical orientation without requiring through-hole processing, Hybrid SIPs are essentially identical to through-hole packages, but with 90° angle pins extending as feet in alternating left/right directions to make the SIP stable on flat surfaces. The packages are compatible with industry-standard automated pick-and-place processing using tape-and-reel or standard matrix tray formats. Virtually all of the firm’s hybrid modules will be available in this package, including dc-to-dc converters, active video filters, line feed resistors, and custom modules not exceeding 4.5” in length.

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.