A land grid array/ball grid array socket has been designed for high performance ASIC applications. The new socket has pressure mount contacts on the top and bottom to prevent overstress on the socket. Offset radial contact with the device’s solder balls will not alter the solder ball bottom surface. Optional bias springs can be built into the socket for accurate device registration. The socket is made from beryllium copper alloy with 30 µ-inches gold per MIL-G-45204 over 50 µ-inches nickel per QQ-N-290, as well as high-temperature liquid crystal polymer. The LGA/BGA socket comes in custom materials, platings, sizes and configurations to suit specific customer applications. Pricing starts at $10 each/500. ARIES ELECTRONICS INC., Frenchtown, NJ. (908) 996-6841.