EE Product News

Software Lets Designers Tackle System-Level Thermal Issues

product pic

Quick, accurate answers to thermal-related questions encountered at the system level is said to be the forte of MacroFlow, a software package comprised of an extensive component library, a generalized procedure for arriving at solutions to thermal problems, and a powerful post-processing capability. The software views the system as a network of components (e.g., card passageways, filters, fans, heatsinks, power supplies, and bends) and air flow paths (ducts and tubes), with variations in pressure drop and heat transfer coefficient correlated with air flow rate for each component. Using the Flow Network Modeling (FNM) technique, MacroFlow can reportedly solve system-wide flow and temperature distribution problems in a matter of minutes, with MacroFlow-based analysis said to examine all possible design options and to select feasible options for later investigation.

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.