Electronic Design

Software Package Automates IP Packaging And Deployment

EASI-Studio 3.0, part of the EASI-Tools family, offers designers automated solutions for packaging and deploying IP in a repeatable and reliable manner. EASI-Studio 3.0 provides the ability to capture multilayer systems using a top-down approach to systems building. It also locates captured IP blocks into a system using a bottom-up methodology. Rising IP and system-on-a-chip complexity calls for consistent data flow. That said, the tool ensures the consistency of design data and facilitates its flow through the development process. For a typical system-on-a-chip project, EASI-Studio is priced between $10,000 and $50,000 per engineer.

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