These thermally conductive compounds are targeted for use in applications requiring the transfer or dissipation of heat to protect sensitive electronic components. While metals have higher thermal conductivity values than plastics, much of their effectiveness is excessive or can be lost due to minimal or insufficient convection in the design. Specifying thermoplastic compounds instead of metal increases design freedom and often consolidates parts, reducing weight and lowering processing costs. Fillers in the compound are said to add important structural properties and reduce "hot spots" by absorbing and distributing heat more evenly than unfilled resins. And the compounds do not corrode and have good chemical resistance. They are available in either electrically conductive or electrically insulative versions in base resins such as PPS, LCP, PC, nylon and others. The compounds can be used for heat sinks and heat pipes, electronic interfaces, housings, high intensity light bulb housings, pumps, pipes and tubing, and transformers.