VSP Adds Bus Protocols

Feb. 16, 2006

Support for additional bus protocols has been added to Carbon Design's Virtual System Prototype (VSP) product line in the form of bus-functional models or transactors. These models for the PCI, PCI-X, USB 2.0 Host, and double-data-rate SDRAM protocols provide a communication layer from abstract functions, such as reads and writes, to pin-level devices listening and/or responding on a bus.

The combination of a transactor and a virtual hardware model produced using Carbon Design's methodology creates a very fast transaction-level model (TLM) that's easily integrated into modeling environments that include instruction-set simulators, idealized behavioral models, and cycle-accurate models. The transactors are available now as options to the VSP product line. Pricing per seat is based on an annual subscription volume model.

Carbon Design
www.carbondesignsystems.com

About the Author

David Maliniak

MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.