Advanced Package Design Fosters Smaller, More Efficient Semiconductors (Download)

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Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and interfacing these next-generation devices between the analog and digital worlds.

This is no simple task, considering the myriad requirements and specifications of electronics and products in today’s market. New circuits are being developed, and existing circuits are constantly evolving, which generally demands redesigning the repackage.