The Many Sintering Options to Boost Power Density (Download)
Doing more with less and, of course, packing more power into a smaller form factor means taking advantage of any applicable technology. One of those technologies is sintering, a well-established alternative to soldering. Sintering can add complexity but also solves many problems.
Sintering plays a critical role in enabling high-density power electronics. It provides a robust, thermally conductive, and reliable method for attaching power semiconductor devices (e.g., SiC or GaN chips) to substrates, leadframes, or heatsinks — especially in demanding applications where soldering reaches its limits (e.g., operating temperatures that can approach the melt point of some solders).