EE Product News

Flip Chips Protect Densely Packed Circuit Boards

The P0402FC05C Series of flip chip devices employ advanced silicon P/N junction technology for board-level transient voltage protection against electrostatic discharges (ESDs) and electrical fast transients (EFTs). Developed specifically for high-density circuit board protection, the silicon flip chips meet or exceed IEC 61000-4-2 and 61000-4-4 Level 4 requirements.
The series is offered in four different array configurations: single (0402), dual (0404), triple (0406) and quad (0408). ESD protection is greater than 25 kV with a peak pulse power dissipation of 250W per line for an 8/20-µs waveshape. In addition, the devices feature low leakage current characteristics and a response time of less than 1 ns. Their low inductance is said to virtually eliminate overshoot voltage due to package inductance. Voltages range from 3.3V to 36V in each of the four different array configurations. Prices start at $0.14 each/100,000.


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