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March 31, 2010

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Solving the contact resistance challenge for 7nm and beyond CMOS

Wearable Skin Patches: The “Hot” Medical Research Field

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Two-Pole Reed Relay Claimed as Industry’s Smallest

IO-Link Adds 4-Channel Master and Signal-Conditioning IC Support

White House Finalizes $6.6B in Funding to Boost TSMC Chip Production

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Modeling on Mondays: An Intro to Simulation of Vacuum-Tube Triodes in SPICE (Part 2)

Running Background Checks on Today’s Celebrity Scientists

Modeling on Mondays: SPICE Modeling of Common Active Devices—An Overview (Part 1)

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