IMEC in Belgium launched its packaging and interconnect centre, APIC, which is committed to bringing together chip makers into research programs for future packaging and system-integration technologies. It will concentrate on bridging the interconnect gap
IMEC in Belgium launched its packaging and interconnect centre, APIC, which is committed to bringing together chip makers into research programs for future packaging and system-integration technologies. It will concentrate on bridging the interconnect gap between circuit and system, heterogeneous integration of RF components, and thermal management in high-power density devices.
