IPC Announces Call for Papers for IPCWorks 2005 Technical Conference

May 11, 2005
Bannockburn, Ill., May 11, 2005 – IPC – Association Connecting Electronics Industries® announces a call for papers for its IPCWorks 2005 technical conference which takes place October 27, 2005, at a new venue – the SandsExpo and Convention Center in

Bannockburn, Ill., May 11, 2005 – IPC – Association Connecting Electronics Industries® announces a call for papers for its IPCWorks 2005 technical conference which takes place October 27, 2005, at a new venue – the SandsExpo and Convention Center in Las Vegas, Nev. This year’s conference theme is “What’s in Your Future?” with conference topics focusing on lead free, using materials declaration information to improve recycling, embedded technology, and materials.

“Participating in the IPCWorks 2005 Technical Conference is a great way for companies to gain visibility within the industry. Many industry leaders use the research and findings of the conference proceedings when developing standards and guidelines,” says Jean Hebeisen, IPC’s director of professional development.

IPC is seeking papers from the following suggested topics:

· Lead free: implementation of lead free; whisker failures, formation, mitigation, etc.; reliability, e.g., temperature, cycling data, tin whiskers evaluations, etc.; lead free solderability; finishes alternative to HASL – organic solder protectants, immersion tin, immersion silver, electroless nickel/immersion gold, palladium, lead free solder leveling, etc.
· Using materials declaration information to improve recycling: environmental issues in recycling; RoHS compliance; materials declaration practices (data model, pdf-based form, business process, required IT technology, trial results, etc.); status of standards activity
· Materials: new materials for PCBs; technology development; materials for design; new dielectric materials (ceramics, biomedical materials, soft materials, nano materials, etc.); new material, technology and waste treatment for environmental protection
· Embedded technology: passives; actives; design; embedded or integrated components fabrication; embedded in flexible circuits; materials

Paper presentations should be 30-45 minutes in length, non-commercial in nature and focus on technology rather than a company’s product. Abstracts that detail case histories, field data, new technologies/innovations or research and findings must be received by June 15, 2005. Abstracts should summarize problems and resolutions, methods used, results of experiments and benefits to the industry. If an abstract is selected, technical papers and visuals will be due on September 15, 2005.

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