Modern high-power RF semiconductors produce extremely high power densities, calling for packing materials with excellent thermal qualities to effectively dissipate the heat. Learn how to sort through different high-power package materials and how beryllium oxide (BeO) compares to other package material options.
Sponsored Recommendations
Sponsored Recommendations
Comments
Comments
To join the conversation, and become an exclusive member of Electronic Design, create an account today!
Sponsored
Sponsored