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Design FAQ: Ceramics For High-Power Packages

Nov. 1, 2011

Modern high-power RF semiconductors produce extremely high power densities, calling for packing materials with excellent thermal qualities to effectively dissipate the heat. Learn how to sort through different high-power package materials and how beryllium oxide (BeO) compares to other package material options.

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Solving the contact resistance challenge for 7nm and beyond CMOS

Six Rules for EEs from Seal Team 6

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What are the Important Considerations when Assessing Cobot Safety?

April 16, 2024

A review of the requirements of ISO/TS 15066 and how they fit in with ISO 10218-1 and 10218-2 a consideration the complexities of collaboration.

Wire & Cable Cutting Digi-Spool® Service

April 16, 2024

Explore DigiKey’s Digi-Spool® professional cutting service for efficient and precise wire and cable management. Custom-cut to your exact specifications for a variety of cable ...

DigiKey Factory Tomorrow Season 3: Sustainable Manufacturing

April 16, 2024

Industry 4.0 is helping manufacturers develop and integrate technologies such as AI, edge computing and connectivity for the factories of tomorrow. Learn more at DigiKey today...