EE Product News

Heat Sinks For Cable Modems Cool BGAs, QFPs, PLCCs and PBGAs

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Designed for BGAs and their variants, the OptiPin line of heat sinks has a 35 mm x 35 mm footprint and is used to cool ICs in cable modems, high-speed network routers, set-top boxes, automotive global positioning systems and high-resolution printers. The devices increase thermal performance and lower temperature rises by up to 20%.

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