For more than six decades, Cinch Connectivity Solutions has addressed the demanding requirements of applications such as space exploration. The company delivers reliable, cost-effective solutions by leveraging its global team of expert engineers, manufacturing, and sales support.
Along those lines, Cinch developed CIN::APSE, which provides high-reliability, high-performance solderless, high-density interconnects for board-to-board, flex-to-board, and component-to-board applications. It’s a crimpless and solderless, high-speed interconnect offering a wide range of profiles from 0.020 in. (0.5 mm) to 1.0 in. (25 mm).
CIN::APSE’s contacts are available in 0.020 in. (0.5 mm) and 0.039 in. (1.0 mm) diameters, with a standard pitch of 0.039 in. (1.0 mm) or greater. The number of contacts isn't limited, and the largest connector implemented to date contained 7,396 I/Os. Solderless termination is achieved through compression, and a contact design assures multiple points of contact per I/O.
Cinch Connectivity Solutions, a Bel group company, has a portfolio that includes connectors, cable assemblies, and custom solutions for industries ranging from space and defense to commercial aerospace, 5G/IoT, and industrial.
