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2024 PowerBest Award Winners for Power Device, Conversion, and Packaging Products

Jan. 24, 2025

Electronic Design's Lee Goldberg chronicles a year of remarkable advances in power, power-conversion and power-management ICs, and packaging technology with a baker’s dozen of 2024's most notable products.

Lee Goldberg

Related To:

Electronic Design

What you’ll learn:

Power devices continue to evolve rapidly as SiC and GaN technologies become more efficient, integrated, and cost-effective.
Meanwhile, steady improvements in MOSFET structures and processes enable moderately priced silicon devices to deliver performance that was only available from wide-bandgap products a few years earlier.
The quest for ever-higher power densities has encouraged the rise of breathtaking levels of active/passive device integration and cool-running packaging technology.

2024 was another remarkably busy year for the power sector, marked by unusually high levels of technical innovation and new product introductions within nearly every application category. This year, we even saw some notable developments in passive components and design tools, making it even more difficult than usual to trim down our long list of deserving candidates to the baker’s dozen of exceptional products that made the cut for this year's PowerBest awards.

To make sure we cover as wide a slice of the power product spectrum as possible, we've spread the awards across three broad, but distinct, product categories:

2024 PowerBest Winners: Power Devices

SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power densities while reducing solution cost. Meanwhile, silicon...

2024 PowerBest Winners: Power Conversion and Management

Higher levels of integration and ingenious power-conversion architectures are enabling simpler, denser, more efficient solutions for EVs, data centers, and other critical applications...

2024 PowerBest Winners: Passives, Packaging, and Applications

Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher power densities and frequencies.

Electronic Design offers our sincere congratulations to the 2024 year's PowerBest award winners, and our deep thanks to the many other worthy candidates who made the selection process so challenging!

About the Author

Lee Goldberg | Contributing Editor

Lee Goldberg is a self-identified “Recovering Engineer,” Maker/Hacker, Green-Tech Maven, Aviator, Gadfly, and Geek Dad. He spent the first 18 years of his career helping design microprocessors, embedded systems, renewable energy applications, and the occasional interplanetary spacecraft. After trading his ‘scope and soldering iron for a keyboard and a second career as a tech journalist, he’s spent the next two decades at several print and online engineering publications.

Lee’s current focus is power electronics, especially the technologies involved with energy efficiency, energy management, and renewable energy. This dovetails with his coverage of sustainable technologies and various environmental and social issues within the engineering community that he began in 1996. Lee also covers 3D printers, open-source hardware, and other Maker/Hacker technologies.

Lee holds a BSEE in Electrical Engineering from Thomas Edison College, and participated in a colloquium on technology, society, and the environment at Goddard College’s Institute for Social Ecology. His book, “Green Electronics/Green Bottom Line - A Commonsense Guide To Environmentally Responsible Engineering and Management,” was published by Newnes Press.

Lee, his wife Catherine, and his daughter Anwyn currently reside in the outskirts of Princeton N.J., where they masquerade as a typical suburban family.

Lee also writes the regular PowerBites series.