The TMS320C55x digital signal processor architecture has been tapped to construct two new DSP chips whose performance and cost are expected to garner for the devices a host of design wins in embedded telecomm, consumer audio, medical, biometric, and industrial sensing applications. Operating at speeds of 300 MHz, the TMS320VC5501 and TMS320VC5502 are dual-MAC DSPs that dissipate a mere 194 mW and feature 16 Kb of instruction cache, 32 KB of core ROM, and a shared core data and program memory scheme (32 KB of DARAM for the C5501 and 64 KB for the C5502) that reduces latencies and expands external memory options compared to a separate scheme. The C5501 and C5502 DSPs also pack a 16- and 32-bit external memory interface (EMIF), respectively, and an 8- and 16-/8-bit enhanced host port interface. The chips also boast of a 6-channel DMA, I2C multi-master and slave interface, hardware UART, programmable phase-locked loop (PLL) with on-chip oscillator, three timers (two general-purpose), one programmable watchdog, and 76 GPIOs (eight dedicated). Other features expected to help the 300-MHz DSPs gain the designer’s attention are code compatibility with an extensive array of existing C5000 devices, an extended operating temperature range of -40°C to +85°C, availability in both 176-pin LQFP and MicroStar BGA packages, and 10K prices of $5 (C5501) and $9.95 (C5502). A 200-MHz version of the latter is also available. Sampling of the C5501 is to begin in Q3 of 2003, with production to start in Q4 of 2003; the C5502 is sampling now and will be produced in volume in Q3 of 2003. TEXAS INSTRUMENTS INC., Dallas, TX. (800) 477-8924.
Company: TEXAS INSTRUMENTS INC.
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