Mindspeed SoC Integrates Picochip Technology

Mindspeed SoC Integrates Picochip Technology

Newport Beach, Calif., U.S.: Mindspeed has released the first system-on-a-chip (SoC) in its portfolio to feature 3G technology from Picochip, the British company it acquired in January. As part of Mindspeed’s Transcede family, the NodeB and eNodeB SoCs enable dual-mode concurrent 3G and Long-Term Evolution (LTE) operation, combining Mindspeed’s LTE physical-layer (PHY) software with Picochip’s HSPA software on Mindspeed’s LTE platform. 

The T22xx and T33xx support all 3GPP standards, including TD-SCDMA, WCDMA/HSPA+, and both frequency division duplex (FDD) and TDD-LTE (time-division duplex), with a roadmap to LTE-Advanced. According to Mindspeed, combining 3G and LTE processing capabilities into a single chip is more cost effective for OEMs, and the inclusion of a carrier-class PHY software solution for both 3G and LTE will reduce time-to-market.

The devices also offer features required for small cells such as secure boot, one-time programmable memories, universal subscriber identity module (USIM) interfaces, and glueless connectivity to local radio transceivers.


TAGS: Digital ICs
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