Electronicdesign 5300 Fci1115 B2

DDR4 DIMM Sockets Accept JEDEC-Qualified Modules

Nov. 18, 2012
Designed for surface-mount termination, FCI’s latest DIMM sockets feature DDR4—a new generation of DDRx memory that’s designed to boost performance, packaging density, and reliability (with reduced power consumption) in next-generation systems
Designed for surface-mount termination, FCI’s latest DIMM sockets accept DDR4 memory—a new generation that’s designed to boost performance, packaging density, and reliability (with reduced power consumption) in next-generation systems. The dual-row connectors, provide 284 contacts on a 0.85-mm pitch, accept DDR4 memory modules that conform to JEDEC MO-309A. Airflow is optimized thanks to a slim connector housing and ejector design. A 2.4-mm module seating plane minimizes overall height after installing a memory module. In addition to surface mount, the company is developing plated through-hole solder and press-fit termination types. Several color options are available for molded housings and ejectors, enabling color coding of DIMM slots on motherboards or other system boards. Acccording to FCI, server manufacturers are increasingly seeking DDR4 connector samples to support early design and validation activities in anticipation of Intel’s Grantley server platform and Haswell server processors, expected for release in early 2014.  Samples of the new FCI DIMM sockets are available now.

FCI ELECTRONICS

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!