Use Advanced PCB Technology To Produce 50% Smaller Product Designs (.PDF download)

June 13, 2014

High-density interconnect (HDI) technology allows printed-circuit board (PCB) designers to increase routing density, reduce layer count, and improve the thermal and electrical characteristics of their board designs...

Register or sign in below to download the full article in .PDF format, including high-resolution graphics and schematics when applicable.

Sponsored

Embedded Mobile Driven by Human Interface

The monitoring of activity for people as operators in a world of M2M communications is moving from a dream to a practical and ubiquitous reality.

All You Need to Know About USB Connectors

In this video learn about all things USB, including the physical USB connector standards, the ever-changing communication and power delivery standards, and more.

MAX25169 150 mA Backlight Driver

This IC integrates one boost converter, one inverting buck-boost converter, two gate-driver supplies, and a boost/SEPIC controller that can power one to six strings of LEDs in...

RC191xx PCIe Gen7 1.8V Fanout Buffer Family with LOS

The RC191xx (RC19108, RC19104, and RC19102) ultra-high performance fanout buffers support PCIe Gen1-7. They provide a Loss-Of-Signal (LOS) output for system monitoring and redundancy...