Electronic Design UPDATE: February 22, 2006

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Electronic Design UPDATE e-Newsletter
Electronic Design Magazine
Electronic Design ==> www.electronicdesign.com
February 22, 2006
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http://news.electronicdesign.com/t?ctl=1F7DE:484C79

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Today's Table Of Contents:
1. Industry View
  *Standards Will Speed Development, Cut Costs For Telecom OEMs
2. Focus On Power
  *15-A POL Converter Is Easily Configured
3. News From The Editors
  *Miniature Motion Sensor Uses Standard CMOS Technology
  *$20 MCU Development Tool Contained In USB Stick
  *Low-Power Wi-Fi Chip Set Brags 20-mm Square Footprint
4. Magazine Highlights: February 16, 2006
  *Cover Feature: Engineering Feature -- Redefining The Workstation
  *Technology Report -- Spring "Board" To FPGA Design Success
  *Leapfrog: First Look -- Novel Digital Isolators Rely On Capacitors
  *Design Solution -- Improve EMC In Class D Amplifier Applications

Electronic Design UPDATE edited by Lisa Maliniak, eMedia Editor
mailto:[email protected]
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1. Industry View -- Exclusive to Electronic Design UPDATE
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Standards Will Speed Development, Cut Costs For Telecom OEMs

By Terry Pearson, VP of Product Management, Enea

Telecom platform development is on the verge of dramatic change. 
Hardware standards such as the Advanced Telecom Computing 
Architecture (ATCA) and Service Availability Forum (SAF) standards 
have created a shift in thinking. Telecom designers now can leverage 
a standard platform, enabling them to focus their energies on 
product-differentiating tasks. The question remains, though, if that 
is the best we can do. The answer is a definitive no. We also now 
have the option of using commercial off-the-shelf (COTS) middleware 
to further reduce development time and cost...

Read the full article at 
http://news.electronicdesign.com/t?ctl=216D6:484C79

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http://news.electronicdesign.com/t?ctl=216D7:484C79

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*******************Live on ElectronicDesign.com*****************

Free Webcast: Boost DSP Throughput with Low-Cost FPGAs
Wednesday, February 22, 2006 at 2:00 pm ET

Designers are increasingly turning to FPGAs to help accelerate DSP 
performance and add extra compute power as a coprocessor. Lattice 
Semiconductor's latest-generation FPGAs have built-in, advanced 
DSP blocks that each contain a pipelined multiplier/accumulator 
engine. Learn how to implement DSP functions in these latest 
low-cost, high-performance FPGAs. One lucky participant will receive 
the ispLever Development Tool for FPGA and CPLD design. Register today!
http://news.electronicdesign.com/t?ctl=2012B:484C79

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2. Focus On Power
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***15-A POL Converter Is Easily Configured
There's no need for programming, external controllers, or bus 
interfaces with the 15-A ZY1015 No-Bus point-of-load (POL) 
converter. Housed in a low-profile package, the 
hardware-configurable digital POL only requires simple pin 
strapping, an external trim resistor, and a capacitor for 
configuration. The ZY1015 utilizes a 3- to 14-V input range and 
provides a 0.5- to 5.5-V user-configurable output that can start up 
into pre-biased loads. Power-management functionality is 
configurable during development or use. The part features sequencing 
with configurable delays, tracking, and cascading between multiple 
outputs; feedback-loop compensation parameters that can be optimized 
for specific applications; noise and electromagnetic-interference 
control via frequency synchronization and programmable phase 
interleave; output current and temperature measurements via 
monitoring pins; and current sharing of up to 10 No-Bus POLs. The 
ZY1015 has a 16- by 32-mm surface-mount footprint and is 8 mm high. 
Pricing is $10.40 each in 10,000-piece quantities. Samples are 
usually available from stock, and production quantities are 
typically available in four to six weeks.
     Power-One Inc. ==> http://news.electronicdesign.com/t?ctl=216D8:484C79

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3. News -- From The Editors
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***Miniature Motion Sensor Uses Standard CMOS Technology
The University of Florida is pursuing a patent on a tiny motion 
sensor that can be produced using standard manufacturing technology, 
a development that may make the technology affordable enough to 
become standard in many consumer devices. The chip is significant 
because it can be manufactured using industry-standard CMOS 
technology. Previous attempts at creating miniature motion sensors, 
while successful, were very expensive to produce because they 
required new or nonstandard manufacturing technology. Although 
developing the first few sensors was expensive, researchers 
estimated it could cost $10 or less if mass-produced. The 3-mm 
square single-chip motion sensor uses one-thousandth of a watt of 
power, meaning it has the potential to operate for as long as a year 
on a standard watch battery. In addition, it's so sensitive that it 
can register sound and motion. A few cell phones, PDAs, and laptops 
already use motion sensors. In PDAs, for instance, they may allow 
users who are reading a book to "turn the page" by simply turning 
the PDA over in their palm.
     University of Florida ==> http://news.electronicdesign.com/t?ctl=216D9:484C79

***$20 MCU Development Tool Contained In USB Stick
Housed in a compact USB stick form factor, the eZ430-F2013 is a 
complete microcontroller (MCU) development and evaluation tool that 
costs just $20. Texas Instruments claims it is the only full MCU 
development tool contained in a USB stick. The tool enables new 
users to evaluate the MSP430 ultra-low-power MCU architecture while 
also giving experienced developers the resources needed to complete 
an entire MSP430 project. The eZ430-F2013 connects to a standard PC 
USB port and is self-powered. The USB stick houses an emulation 
interface board and removable MSP430F2013 target board. Only two 
signals -- power and ground -- are needed to connect the emulation 
interface and target. A free IAR Kick Start Embedded Workbench IDE 
containing a debugger, assembler, and C compiler also is included. 
Users can tap into more than 100 free C and assembler source code 
examples that are available from TI's Web site.
   Free eZ430-F2013 tools will be provided to attendees at TI's 
fourth annual 430 Day, to be held at more than 100 locations 
worldwide beginning in May 2006. This free three-hour event will 
offer a detailed overview of the MSP430 ultra-low-power MCU and 
live eZ430 demonstrations. Register for 430 Day at the TI Web 
site.
     Texas Instruments ==> http://news.electronicdesign.com/t?ctl=216DA:484C79

***Low-Power Wi-Fi Chip Set Brags 20-mm Square Footprint
The low-power NRX700 Wi-Fi chip set from Nanoradio AB has a total 
die size of 20 mm square, which the company claims is the smallest 
footprint in the market. The two-chip NRX700 targets mobile phones 
and other handheld applications. In addition, it supports the 
emerging need for wireless local-area network functionality in 
headsets and other audio devices. The NRX700 consists of a 
silicon-germanium RF transceiver IC with an on-chip RF power 
amplifier and a CMOS baseband-MAC IC with on-chip power management. 
Current consumption is 130 mA at +18-dBm RF output, 53 mA during 
receive mode, and 0.05 mA in standby. The NRX700 chip set is 
available both as bumped die and in a system-in-package solution 
that includes RF filters, baluns, and an antenna switch. Evaluation 
kits of the NRX700 are available now. Production quantities are 
expected in the third quarter of 2006.
     Nanoradio AB ==> http://news.electronicdesign.com/t?ctl=216DB:484C79

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Electronic Design Is Looking For A Technology Editor

Are you a talented engineer with a knack for writing? Then we may 
have the job for you. Electronic Design is looking for a new 
Technology Editor to do front-line writing for print and associated 
eMedia properties. This editor will develop and write feature 
reports, product coverage, news, and columns. The qualified 
candidate needs the ability to clearly present technical information 
in written form. A strong electronic engineering background and 
familiarity with any of a wide range of electronic technologies is 
required, and expertise in digital semiconductor technology is preferred.

Interested candidates should e-mail their resume to Editor-in-Chief 
Mark David at mailto:[email protected].

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4. Magazine Highlights
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In case you missed them, here are some of the high points of our 
most recent issue.

February 16, 2006:

* Cover Feature: Engineering Feature -- Redefining The Workstation
Embedded PCs In Instrumentation, distributed communications, and 
software are connecting engineers to new test tools.
http://news.electronicdesign.com/t?ctl=216DC:484C79

* Technology Report -- Spring "Board" To FPGA Design Success
FPGA development boards run the gamut from simple evaluation cards 
to application-targeted models that let you explore options.
http://news.electronicdesign.com/t?ctl=216DD:484C79

* Leapfrog: First Look -- Novel Digital Isolators Rely On Capacitors
A new brand of isolator pushes CMOS signaling rates to 150 Mbits/s 
and magnetic isolation to six orders of magnitude beyond the specs.
http://news.electronicdesign.com/t?ctl=216DE:484C79

* Design Solution -- Improve EMC In Class D Amplifier Applications
Besides reducing EMI, new modulation techniques and filter 
architectures provide the cost benefits and audio performance of 
class AB designs.
http://news.electronicdesign.com/t?ctl=216DF:484C79

For the complete Table of Contents, go to Electronic Design ==>
http://news.electronicdesign.com/t?ctl=216E0:484C79

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EiED Online -- Bus and Board Show: Part 2

Embedded in Electronic Design (EiED) Online is your source for 
technical insight and hands-on reviews. Read Technology Editor Bill 
Wong's latest EiED Online column, "Bus and Board Show: Part 2." This 
year's Bus and Board show brought out a range of issues, from the 
European Union's Restrictions on Hazardous Substances to VME's 25th  
anniversary. Hear about the new Aurora fabric, and find out what 
else Bill Wong discovered at the show. 

http://news.electronicdesign.com/t?ctl=20D25:484C79

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TAKE A POLL!

In his recent State of the Union Address, President Bush proposed an 
American Competitiveness Initiative. Which element of that 
initiative will best prepare the U.S. to compete in the global 
marketplace?

-- Increased funding for technology research programs
-- A permanent R&D tax credit
-- More rigorous math/science education programs

Vote at Electronic Design ==> http://news.electronicdesign.com/t?ctl=15410:484C79

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CONTACTS: Electronic Design UPDATE e-NEWSLETTER
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Editorial: Mark David, Editor-in-Chief
mailto:[email protected]

Advertising/Sponsorship Opportunities: Bill Baumann, Publisher:
mailto:[email protected]
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