Fourth-Gen LIN System Basis Chip Built For In-Vehicle Networking

Fourth-Gen LIN System Basis Chip Built For In-Vehicle Networking

A new local interconnect networking (LIN) system basis chip (SBC) for low-power LIN systems is expected to find homes in automotive comfort, powertrain, sensor, and actuator applications. Atmel’s fourth-generation ATA663254 offers lower current consumption in various modes of operation. An integrated low-dropout (LDO) voltage regulator, combined with low-cost multi-layer ceramic (MLC) blocking capacitors, saves costs versus tantalum capacitors. It works down to 2.3-V supply voltage, enabling storage of data within the microcontroller (MCU) during system shutdown due to unintended power-supply interruption. The LIN SBC, certified to LIN specification 2.0, 2.1, 2.2, 2.2A, and SAE J2602-2, is developed on a bipolar CMOS and DMOS-on-silicon on insulator (BCD-on-SOI) process technology that allows for high-temperature operation, high-level electromagnetic-compatibility performance, and low-leakage currents. The device consumers less than 290 µA in normal mode, less than 170 µA in linear mode, and less than 15 µA in sleep mode. Packaging is a compact DFN8.



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