Module Makes High Speed USB Easy

May 7, 2009
Need a High Speed USB serial link? Then check out DLP Designâ??s module based on the latest chip from Future Technology Devices International (FTDI). The DLP-USB1232H has a standard 18-pin dual-inline package (DIP) form factor. The FT

Need a High Speed USB serial link? Then check out DLP Design’s module based on the latest chip from Future Technology Devices International (FTDI). The DLP-USB1232H has a standard 18-pin dual-inline package (DIP) form factor. The FTDI FT2232H is designed to handle the 480-Mbit/s High Speed USB specification, allowing the system to handle transfers up to 12 Mbaud, essentially being limited by the RS-232 transfer rate. The chip can handle bulk transfers, and it supports hardware flow control.

DLP DESIGN

FTDI

See associated image

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Cornell Dubilier: Push EV Charging to Higher Productivity and Lower Recharge Times

April 8, 2024
Optimized for high efficiency power inverter/converter level 3 EV charging systems, CDE capacitors offer high capacitance values, low inductance (< 5 nH), high ripple current ...

TTI Hybrid & Electric Vehicles Line Card

April 8, 2024
Components for Infrastructure, Connectivity and On-board Systems TTI stocks the premier electrical components that hybrid and electric vehicle manufacturers and suppliers need...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!