Remcom announced that its XFdtd 3D Electromagnetic Simulation software will feature projected capacitive-touch capability. The software computes the matrix of self- and mutual-capacitance between any number of conductors in a model, which can be almost any arbitrary shape and complexity. Designs can be imported from CAD, and support for complex geometries allows for analysis within fully populated devices. Projected capacitive-touch capability is a crucial element in designs implementing touchscreen-panel (TSP) technology, such as mobile devices, desktop computer monitors, touchpads, proximity sensors, etc.
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