Expected to launch a wave of lower-power, Internet-attached consumer electronics, the PowerPC Internet Appliance Platform (IAP) combines a microprocessor with a number of optional computing features onto a single system on chip (SoC). Via these optional features, manufacturers can tailor a chip to their design as opposed to compromising the physical design to accommodate a standard device.
The IAP consists of a combination of design and manufacturing technologies. These include the ability to manufacture extremely dense circuits using copper wire, silicon-on-insulator transistors, and low-k dielectric insulation.
Company: IBM - Microelectronics Division
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