EE Product News

SoC Predicts Lower-Power Internet Appliances

Expected to launch a wave of lower-power, Internet-attached consumer electronics, the PowerPC Internet Appliance Platform (IAP) combines a microprocessor with a number of optional computing features onto a single system on chip (SoC). Via these optional features, manufacturers can tailor a chip to their design as opposed to compromising the physical design to accommodate a standard device.
The IAP consists of a combination of design and manufacturing technologies. These include the ability to manufacture extremely dense circuits using copper wire, silicon-on-insulator transistors, and low-k dielectric insulation.

Company: IBM - Microelectronics Division

Product URL: Click here for more information

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.