EE Product News

Plastic FPGAs Meet Military Temperature Specs

An alternative to more expensive ceramic FPGAs for military applications, pASIC 1 and pASIC 3 families of plastic-packaged devices are qualified and tested to operate over the industry-standard military temperature range of -55°C to 125° C. The military grading is made possible by the low power dissipation of the devices, which offer a standby current of only 500 µA for a power consumption of just 1.65 mW. This low power results in low heat to let the plastic package operate reliably at 125° C.


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TAGS: Digital ICs
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