The QuickSilver™ Series of post fab inspection tools detects and classifies visual defects such as deformed, bridged, or missing bumps; extraneous material; etch residue; particles; scratches, and passivation voids. The dual-cassette robotic wafer-handling systems feature a touch-screen user interface and an engineered laminar-flow clean environment and are network-ready with NT protocol support.
Four models are available: the QS-100 microstructure for measurement of critical dimensions on devices and packages; the QS-200 for wafer defect inspection at probe, final, and other fab operations; the QS-300 for 2-D measurement of bump diameter and placement and defect inspection, and the QS-330 for 3-D measurement of bump dimensions and defects after bump reflow. $500,000 to $750,000. Electroglas, (408) 727-6500.
Copyright 1998 Nelson Publishing Inc.
July 1998
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