The ETC 1000 Thermal Control System with Power Balancing™ is designed for die and transistor junction temperature control for devices such as microprocessors and systems-on-a-chip ASICS. The system offers ±2°C junction temperature control for power densities of +30 W/cm2 and features a -35°C to +125°C set-point temperature range.
With the ECT 1000, it is not necessary to attach a heat sink or slug to the device for test. The system also allows thermal profiles and transition rates to be programmed to accommodate characterization flexibility.
Other key features include an ATE interconnection for start of test/end of test (SOT/EOT), on-system data collection, a dynamic temperature analysis package, support for standard data formats and charting packages, a touch-screen operator interface, PC/NT controls, and a LabVIEW extendible software environment. Starts at $156,000. Schlumberger ATE, (408) 453-0123.
Copyright 1998 Nelson Publishing Inc.
September 1998
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