Center-probe sockets handle lead pitch down to 0.30 mm

High-frequency center-probe test sockets are available for ball grid array, chip-scale, and micro land frame packages with a lead pitch of 0.30 mm. Features include a four-point crown or sharp-point gold-plated pitch probe pin, spring, and flanged bottom pin; a 0.077-in. signal path; solderless pressure-mount spring probes; and a life cycle up to 500,000 cycles.

Contact forces are 15g per contact on a 0.30-mm to 0.35-mm pitch, 16g on a 0.40-mm to 0.45-mm pitch, and 25g on a >0.50-mm pitch. Contact resistance is <40 mΩ; probe self-inductance is 0.51 nH for large probes and 0.59 nH for small probes. Insertion loss is 1 dB to 10.1 GHz for a larger probe at 0.80 mm pitch and 1 dB to 18.7 GHz for a smaller probe at 0.50 mm pitch. Aries Electronics