October 14, 2011. NuSil Technology LLC, a formulator and manufacturer of silicone compounds for the electronics industries, has unveiled R-2188, a solvent-free, two-part, translucent silicone system. R-2188 can be used as a compliant, high-strength adhesive and encapsulant in power electronics applications specifically requiring a highly insulative material.
R-2188 is a non-corrosive material with a low modulus that overcomes stress between materials with different coefficients of thermal expansion (CTE). Due to its high dielectric strength, it can withstand medium and high voltage; thermal and mechanical stress; and long, elevated operating temperatures.
R-2188 has a variable cure schedule, low shrinkage, and is easily repairable. It is effective in potting, encapsulating, and coating modules, relays, power supplies, delay lines, or complete electronic units, as well as a dip-coating for encapsulating components and printed circuit boards. A low-viscosity elastomer with a long work time, R-2188 is also suitable for automatic dispensing.
www.nusil.com/products/engineering/electronics/index.aspx.