Keysight test system achieves EMVCo qualification

Keysight Technologies has announced that the EMVCo global technical body has qualified the Keysight T3111S EMV Level 1 PICC and Mobile Digital Protocol test suite with the Keysight T1141A test set.

This news follows an earlier announcement made by FIME and Keysight in March, when qualification was achieved for the EMV Level 1 RF test suite developed by FIME with the Keysight T1141A test set.

The T1141A-based systems now offer the industry one of the most qualified single-platform coverage for Contactless Card and Mobile EMV Level 1 test. Qualification is underway also for existing FIME Analog and Keysight Digital Protocol PCD (Proximity Coupling Device) test suites.

“We are very happy to have received EMVCo qualification for our PICC and Mobile Digital Protocol test suite,” said Joe De Pond, vice president and general manager, Mobile Broadband Operations, Keysight. “Recognition for our EMV PICC and Mobile Level 1 test suite, together with our existing array of validated NFC Forum test suites, enables us to support our customers with one the NFC industry’s most comprehensive conformance test platforms.”

Developers will use the newly qualified test suites for certification test in test laboratories and as the developers prepare their mobiles and contactless card payment devices for certification. The flexible and easy to use T3111S system is used throughout the NFC and contactless payments industry, providing users with key insights and accelerating the development and verification processes.

The T3111S NFC Test System includes validated test suites for NFC Forum certification test including Digital Protocol, Analog, LLCP and SNEP. Proximity and vicinity ISO test suites are also supported.

Keysight offers an easy upgrade path for its customers to integrate EMVCo and NFC testing in their test systems.

About the Author

Rick Nelson

Rick Nelson

Contributing Editor

Rick Nelson is a technical journalist who has served as executive editor of Test & Measurement World, chief editor of EDN, and executive editor of EE-Evaluation Engineering. He has also contributed to publications including Vision Systems Design and Electronic Design, and he has participated in many live panel discussions and webcasts. Rick has also held systems-engineering and product-development positions at General Electric and Litton Industries. He received his B.S.E.E. degree from The Pennsylvania State University.

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