IPC joins NextFlex flexible hybrid manufacturing institute

Feb. 26, 2016

Bannockburn, IL. IPC-Association Connecting Electronics Industries has become a partner of NextFlex, America’s flexible hybrid electronics manufacturing institute, which is based in Mountain View, CA. As part of the National Network for Manufacturing Innovation (NNMI), this new public-private partnership aims to establish America as the global leader in the flexible hybrid electronics manufacturing space.

Among other things, as a NextFlex partner, IPC will apply its strength and expertise in standards development to assist the institute in creating roadmaps for industry standards for flexible hybrid electronics manufacturing. Since 2012, IPC has published five standards on printed electronics materials, processes, terms and definitions, and design. The IPC Printed Electronics Committee is also working on six additional standards. As a member of the institute, IPC and NextFlex will explore ways to collaborate on printed electronics standards and test methods. Collaborative efforts will provide the printed electronics community with the standards and education needed to advance this technology, shorten product lead times, and improve and enhance product performance.

“IPC looks forward to being a part of NextFlex to advance innovation in flexible hybrid electronics manufacturing,” said Ken Schramko, IPC director of government relations. “IPC has been a strong supporter of the NNMI, which was launched by the Administration to drive American competitiveness in advanced manufacturing. IPC played a lead role in promoting the Revitalize American Manufacturing Innovation (RAMI) Act of 2014. This legislation authorized the NNMI and was signed into law by President Obama in December 2014.”

www.IPC.org

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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