The new RF Magnetics Lab Kit helps educators bring practical, hands-on experience into their classrooms and instructional labs. The kit contains a selection of chip and air-core inductors, LC filter modules, and wideband transformers, and it is offered free to accredited electrical engineering programs.
The kit is the latest example of Coilcraft’s continuing effort to support the next generation of electrical engineers, following on the Power Magnetics Lab Kit introduced two years ago. The company also offers a variety of other resources to students and educators, including design tools, a library of application notes, and lab posters. Coilcraft
The new Models 50-200 and 50-201 PCI fault-insertion switching products are designed for use with differential serial interfaces. The Model 50-200 switch handles lower data rate serial interfaces such as CAN and FlexRay. The high-bandwidth Model 50-201 accommodates higher data rate serial interfaces such as AFDX and 1000BaseT Ethernet. Pickering Interfaces
The Signaling Tester MD8475B supports up to four component-carrier-aggregation and 2×2 MIMO implementations in a single test box. Integrated with the SmartStudio GUI, the MD8475B lowers cost of test and reduces space requirements compared with conventional solutions that require several test instruments. It also can conduct tests on chipsets, modules, and mobile platforms with the most recent LTE-Advanced specifications.
Improved IP throughput test efficiency is achieved via the built-in IP Packet Generator function of the MD8475B. This feature simplifies the test environment by removing the need for hosting a client/server on an external PC.
SmartStudio Manager facilitates automated UE testing and improves development efficiency by offering seamless transitions to regression and stress tests. In addition to supporting existing test cases created with the first-generation MD8475A, SmartStudio Manager can automate full network tests by calculating the combinations of CC numbers, MIMO numbers, and wireless frequency bands required for LTE-Advanced evaluations. Anritsu
Cross-platform development
Now available for download, Qt 5.7 features pioneering UI creation, including a new Qt 3D module as well as new ways to create modern touch-based UIs with Qt Quick Controls 2 and Qt Quick Designer. Qt 5.7 follows the evolution of modern C++, leveraging C++11 in Qt APIs.
With Qt 5.7 and the new Qt 3D module, it now is easy to create 3D UIs and interact with 3D objects using high-level Qt C++ and QML APIs. Visualizing a 3D model with Qt 3D takes minutes instead of hours or days of OpenGL programming. In addition to 3D rendering, Qt 3D is a fully extensible 3D framework for near-real-time simulations. Qt 3D has been developed together with KDAB, the vendor’s service partner external contributor. The Qt Co.
Low-power MCUs
The PIC32MM product line bridges the gap between the vendor’s PIC24F XLP and PIC32MX families. The new MCUs are the first PIC32 parts to feature core independent peripherals designed to offload the CPU for lower power. The PIC32MM devices are supported by the MPLAB Code Configurator to help simplify and accelerate designs.
Today’s embedded applications targeting the Internet of Things, consumer, industrial control, and motor control require flexible MCUs that consume less power, are more cost effective, and have smaller form factors. For applications demanding low power and longer battery life, the PIC32MM has sleep modes down to 500 nA. Applications with space constraints will benefit from the small 4 x 4 mm package options. Microchip
PCI Express 4.0 test
Enhancements to the vendor’s suite of PCI Express (PCIe) test solutions include support for the 16-GT/s data rate and automated transmitter and receiver test solutions supporting the PCIe 4.0 architecture.
With the faster data rates for PCIe 4.0 technology come new test challenges, such as major increases in channel loss, tightening of the total jitter budget, and more complex link training and timing requirements. As design margins shrink, accurate and standard-specific measurement solutions play a vital role in debug, design verification, and interoperability testing. All of these needs are met by the vendor’s latest test solutions for PCIe 4.0 and 3.0 in conjunction with DPO70000SX high-performance oscilloscopes. Tektronix
The free InTemp mobile app for the company’s InTemp CX400 Series products for pharmaceutical cold-chain monitoring applications now supports Android mobile devices.
The InTemp CX400 Series includes a range of high-performance Bluetooth Low Energy data loggers for monitoring temperatures in refrigerators, freezers, and controlled-temperature storage areas. The mobile app enables users to easily view temperature data from CX400 loggers, check logger status, set alarms, and create and share secure PDF reports from their Android and iOS mobile devices. Onset
The FireBird Camera Link Deca board now is available in two form-factors: a full-height version with a front-panel IO and a low-profile/half-height version. The half-height design allows the FireBird to be used in small embedded PC enclosures and rack-mount cases where full-height PC cards are not suitable. A full-height bracket option accommodates use in standard PC form-factor enclosures.
FireBird uses the vendor’s proprietary DMA engine technology, ActiveDMA. This technical innovation applies RISC-based processor techniques and guaranties zero CPU intervention, high speed, and very low latency image data transfers. Active Silicon
The LGA 3647 socket for Intel’s new processors meets the next-generation design requirements of these latest CPU processors for higher performance and better system scaling.
The LGA sockets provide a compressive electrical interconnect between the processor and the printed circuit board. As computing power increases, processor chips’ pin counts are increasing. The LGA 3647 socket features a two-piece design for the larger processor that improves issues with warpage and offers better coplanarity and reliability in connectivity. Flexible tooling also supports fast turnaround on prototypes so engineers can have sockets in hand at the earliest stages of the design process. TE Connectivity