MIPI Alliance debuts Discovery and Configuration (DisCo) portfolio

Jan. 19, 2017

Piscataway, NJ. The MIPI Alliance has introduced the MIPI Discovery and Configuration (MIPI DisCo) portfolio, a family of specifications that simplifies software driver development when integrating components in mobile-connected products.

MIPI Alliance is offering the solutions to its members and the open-source community to encourage widespread adoption of the specifications and motivate the community to share its software development resources. Developers can learn more and access MIPI DisCo specifications here: http://bit.ly/2iZFI8c. Membership in MIPI Alliance is not needed to access the specifications, but the organization welcomes new members.

“MIPI Alliance provides building blocks for component integration and platform development, and with MIPI DisCo companies can now use software as an enabler to accelerate time-to-market for designs targeting the mobile, automotive, and the IoT industries,” said Joel Huloux, chairman of the board of MIPI Alliance.

“MIPI DisCo’s software specifications reduce fragmented solutions and will help component vendors promote greater adoption of their products and technologies,” said Rob Gough, chair of the MIPI Alliance Software Working Group. “By minimizing the need for custom software development, the tools will dramatically reduce complexity and ease the burden for developers.”

The new portfolio includes a software architectural framework and family of specifications covering the many types of components embedded in mobile-connected devices.

MIPI DisCo Base Specification, the base architectural framework available today, defines a uniform software architecture that can be used with a device’s host operating system to discover, enumerate, and manage controllers, buses and other components that use MIPI Alliance specifications.

The MIPI DisCo architecture is based on the Advanced Configuration and Power Interface (ACPI), which is widely used in the PC industry to enumerate devices and functions, describe their capabilities and manage their power states. It is supported by all major operating systems.

The MIPI DisCo Base Specification is used in conjunction with other MIPI DisCo specifications, which define the capabilities of specific devices or controllers that can be managed by the MIPI DisCo architecture. MIPI DisCo Class specifications will be released individually to cover integration of audio peripherals, batteries, camera and imaging devices, sensors, and other components, as well as debug and test functions.

The first interconnect-specific specification, MIPI Discovery and Configuration for SoundWire (MIPI DisCo for SoundWire), is scheduled for release later this year and will streamline software integration of amplifiers, microphones, and audio codecs that are built into smartphones, tablets, mobile PCs, connected cars, and IoT devices that use the MIPI SoundWire interface. The solution enables developers to easily discover OS-agnostic device property definitions required by the SoundWire bus driver.

“The MIPI DisCo for SoundWire specification will help minimize the amount of device-specific code required for support in operating systems such as Microsoft Windows and Linux/Android,” said Pierre-Louis Bossart, chair of the MIPI Alliance Low-Speed Multipoint Link Working Group. “It also provides platform-level information on the bus topology and lets the system integrator customize the SoundWire subsystem without changing the operating system and drivers.”

The MIPI Software Working Group works closely with other MIPI Alliance technical working groups to identify and define software integration requirements to support MIPI Alliance interfaces. The group is actively seeking members to help define software integration needs and requirements for camera, display/touch, and debug specifications. All MIPI Alliance members at the Contributor level and above are welcome to participate in the working group.

Developers are invited to attend the webinar “MIPI DisCo and ACPI: Streamlining MIPI Component Integration” on February 2, 2017, at 11:00 am EST, 8:00 am PST. For information and registration, visit http://bit.ly/2iWcvLF.

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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