Multitest Mi Con Contactor

Multitest MiCon contactor offers cantilever design for MCU, ASIC test

Aug. 2, 2017

Rosenheim, Germany. Multitest announced it has recently launched the MiCon contactor. The reports the MiCon leverages industry-proven cantilever technology for final test of microcontrollers, industrial DSPs and application-specific ICs. Evaluations at customer test floors showed substantial improvements in first pass yield, life span, and cleaning cycles compared with spring-pin solutions, the company said, adding that MiCon fully supports the requirements of a high, stable, and reliable production output at low cost of test.

MiCon leverages the cantilever technology architecture to match existing spring-pin test boards and to provide self-cleaning wipe. MiCon is a spring-pin footprint compatible alternative supporting advanced temperature requirements as well as advanced power/current requirements. The footprint compatibility allows for easy and cost-efficient conversion from spring-pin setups. The fully decoupled load board side of the spring ensure no degradation of the load board pad.

MiCon features a single piece design, which ensures a long lifespan, low and stable contact resistance, high current carrying capability, and an extended temperature range. The MiCon allows for testing at full specification values. The extended operating range accommodates device lead trim and form variability such as device alignment accuracy and device lead coplanarity.

Marcel Sans, project manager, explained, “The performance reports, received from the onsite customer evaluations, showed extraordinary advantages compared to the traditional spring-pin solutions with a first-pass yield of 99.8%” In addition, he said, time between cleaning cycles more than doubled, and the contactor provided full contacting performance without signs yield degradations at high insertion counts.

www.multitest.com/MiCon

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RN (editor)

This post was selected and edited by Executive Editor Rick Nelson from a press release or other news source. Send relevant news to [email protected].

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