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EE's sights from DesignCon 2019

Feb. 5, 2019

The 24th annual DesignCon was held Jan. 29-31 in Santa Clara, CA, in the heart of Silicon Valley. The yearly event brings together nearly 5,000 professionals from the high-speed communications and semiconductor communities for three days of education, networking, and exposition. Self-described as the nation’s largest event for chip, board, and systems engineers, DesignCon offered a 15-track conference program, curated by a 99-person technical program committee, while each day also featured a keynote session.

Filling the Santa Clara Convention Center expo hall were more than 175 vendors, showing off their latest and greatest solutions in test and measurement equipment, electrical components, connectors, signal integrity, and more.

I was on-hand to take in DesignCon’s second and third days, and I was snapping photos along the way. Here’s a collection of what I saw:

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