Masood Murtuza is the Manager of Package Engineering and a founder of Octavo Systems. Prior to joining Octavo, Masood was a Fellow at Texas Instruments, where he held various leadership roles in the Packaging and Assembly Process Engineering teams. During his tenure at TI, he introduced a number of new semiconductor packaging technologies. He also helped advance innovation in technology development across the company by establishing new methodologies in package and assembly development process. Masood holds 25 patents and has authored or co-authored over 15 papers. He received his BTech in Mechanical Engineering from the Indian Institute of Technology, Madras, India, and an MSc in Naval Architecture from University College, University of London.