Mike Deppe is Vice President of Global Product Development at Molex. Previously, he was Vice President & General Manager for Molex RF & Printed Circuit Solutions Business Units. He has over 20 years of experience in printed electronics and automated assembly and leads Molex’s global efforts to be the preferred partner for components, interconnect, and assemblies that enable innovation and commercialization of RF technologies.
Mike has held various progressive roles in Engineering, Project Management, and Operations overseeing facilities in Taiwan, China, Canada, and the U.S. He led product development responsibilities for human-machine interface (HMI) assemblies, copperflex products, printed electronics, and sensor systems, where he managed and steered the development efforts in advancing manufacturing, processing, and capabilities of hybrid electronics.
Mike earned degrees in Mechanical Engineering and Economics from Purdue University.