• Christopher Hunat

    Package Development and Assembly Engineering Manager, imec
    christopherhunat

    With over 23 years of experience in the semiconductor industry, Christopher Hunat has held key roles across several leading technology companies like Apple, Philips Semiconductors, NXP, STMicroelectronics, Socionext, and imec. He has successfully led cross-functional teams, managed complex 2.5D packaging projects, and driven innovation in areas such as substrate design, signal and power integrity analysis.

    Christopher is working as Package Development and Assembly Engineering Manager, under Product Engineering (DSRD), at imec, which provides service in terms of developing a packaging solution optimized for customer design and assembly requirements.