Die Attach Adhesives Exhibit Low Bleed

Oct. 1, 2000
These electrically conductive die attach adhesives are designed specifically for plastic ball grid array packaging and matrix style BGA designs. They can withstand higher temperature reflow for lead-less electronic assembly with optimized adhesion,

These electrically conductive die attach adhesives are designed specifically for plastic ball grid array packaging and matrix style BGA designs. They can withstand higher temperature reflow for lead-less electronic assembly with optimized adhesion, stress, and moisture absorption. Engineered with a low modulus, the materials are suitable for a wide range of die sizes, from 150 x 150 mil square to 1000 x 1000 mil square. In addition, the Ablebond 2000 series adhesives exhibit very low bleed on solder mask surfaces, a critical requirement for fine pitch BGA applications.

Company: ABLESTIK LABORATORIES

Product URL: Click here for more information

Sponsored Recommendations

X-Band Transceiver

March 13, 2024
Aerospace and Defense applications conform to the tightest standards. ADI provides you with the confidence and support to ensure your design is a success.

ADVANCED MICRO SOLUTIONS FOR AUTOMOTIVE APPLICATIONS

March 13, 2024
Our solutions and technologies are designed to enable optimum safety on the road for electronic systems enabling safe, self-driving electronic mobility solutions.

Connectors for Automated Process Systems

March 13, 2024
Almost every product that people touch in their daily lives is the result of an automated manufacturing process. This includes relatively simple assemblies such as cereal boxes...

+600C Series RTD Platinum Temperature Sensor

March 13, 2024
Innovative Sensor Technologys temperature sensors have a small but robust construction to ensure function in harsh conditions

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!