These electrically conductive die attach adhesives are designed specifically for plastic ball grid array packaging and matrix style BGA designs. They can withstand higher temperature reflow for lead-less electronic assembly with optimized adhesion, stress, and moisture absorption. Engineered with a low modulus, the materials are suitable for a wide range of die sizes, from 150 x 150 mil square to 1000 x 1000 mil square. In addition, the Ablebond 2000 series adhesives exhibit very low bleed on solder mask surfaces, a critical requirement for fine pitch BGA applications.
Company: ABLESTIK LABORATORIES
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