EE Product News

Gap Fillers Conduct Heat Away From Large Spaces

Effective in a variety of electronic and telecommunications applications, the TC2000 gap filler makes contact between components and heat sinks where a large gap is generated in assembly design, or where stack-up tolerances are unpredictable. These fillers are die cut from two newly developed, thermally conductive gap filler compounds, said to make an effective thermal path between heat sources and heat sinks. The product is a very soft, proprietary silicone formulation that conforms to surface contours and variations. Performance is achieved with low mounting pressure and the tacky surface eliminates the need for an adhesive. Compression in applications ranges from 10% to 50% and the fillers come in thicknesses ranging from 0.02" to 0.2". Thicknesses of 0.12" and greater meet the UL94 V-1 rating for flame resistance.


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TAGS: Components
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