Master Bond’s Thermal Adhesive Handles Up To 400°F

Resisting a wide range of chemicals and some solvents over a temperature range from 60°F to 400°F (-50°C to +205°C), the EP21AOHT two-component, thermally-conductive epoxy adhesive/sealant/coating specifies a thermal conductivity figure of over 1.44 W/°K. It is said to adhere unusually well to a wide variety of substrates including metals, glass, ceramics, and many plastics. It forms bonds exhibiting 5,000 psi of tensile strength, 2,000 psi of shear, and over 20,000 psi of compression. The compound's compressive modulus is 620,000 psi. Other features include a 1:1 mixing ratio, self-leveling capability, and flexible cure schedules ranging from room temperature to fast, elevated-temperature cures. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.