Electronic Design

Packaging: Qualified SOIC Packages Serve Automotive And Power Applications

Next-generation automotive and power applications will benefit from a fully qualified family of high-reliability small-outline IC (SOIC) packages. The narrow-body packages provide zero delamination after MSL 1, 260°C pre-conditioning testing, which significantly improves the overall reliability of the end product. They also save packaging and shipping costs. The fully qualified SOIC packages are available now. Pricing is approximately $0.005 to $0.008 per lead, depending on volume and package configuration.

Advanced Interconnect Technologies

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