EE Product News

Pads Can Replace Grease As Thermal Interface

Designed to replace grease as a thermal interface, Flexible Hi-Flow is a filled polymer that comes in pad form for ease of handling and installation. At 65°C, the material changes from a solid and flows to assure total wet-out of the interface. The thixotropic characteristics of the material keeps it from flowing out of the interface, resulting in a thermal interface comparable to grease without the mess, contamination potential or difficult handling associated with grease. Typical applications include CPUs mounted to heatsinks, power conversion modules, or other spring clip mounted applications where grease is normally used.


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TAGS: Components
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