Underfill Technology Eliminates Fluxing For Flip-Chip Devices

Combining solder flux and underfill in a single material, AMICON E 1330 series of no-flow-fluxing encapsulants enables the rework of flip chip assemblies by not curing through the reflow cycle. This allows the flip chips to be tested and removed prior to curing the underfill, leaving the substrate "same as original" and ready to accept another flip chip. A post cure is then required. Use of flow-fluxing encapsulants eliminates tedious and expensive fluxing, flux cleaning and underfill capillary flow to make the process SMT compatible. By contrast, AMICON E 1350 does cure during a modified reflow cycle and no post cycle is required.