Masterbond Ep4s80
One component, silver-filled epoxy with a curing temperature of 80°C
Master Bond
Master Bond EP17HTND-CCM
One component, high temperature resistant epoxy system for bonding and sealing
Master Bond EP3HTSDA-2
One component epoxy system featuring excellent electrical and thermal conductivity
Master Bond
Master Bond EP3UF-1
One component epoxy for bonding and underfill applications
Master Bond Ep4 En 80
One component flowable epoxy for bonding and small encapsulation applications with a curing schedule at 80°C to 85°C
Dow Logo
With a broad portfolio of electronics materials and global technical expertise, we are ready to deliver on today’s needs and collaborate with you on tomorrow’s challenges.
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ANL is a high volume 2D material foundry and producer of monolayer graphene and other two-dimensional material sheets with a low defect density.
Avishtech Logo
With our industry-leading Gauss suite of printed-circuit simulation, design, and development software, and our exciting projects in the pipeline, Avishtech is your guide, your...