Materials & Packaging | Electronic Design

Materials & Packaging

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Thermal Management

ZutaCore

ZutaCore offers waterless direct-to-chip liquid cooling for AI and HPC.

Feb. 6, 2025

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Materials & Packaging

DuPont

Jan. 7, 2025

Master Bond Supreme 3DM-85 is a toughened, one part epoxy that can be used for bonding, sealing, and dam-and-fill applications.

Master Bond Supreme 3DM-85 One-Component Epoxy

April 1, 2024

Supreme 17HTND-2 is a one component toughened epoxy system for bonding and sealing.

Master Bond Toughened, One Component Epoxy Features High Glass Transition Temperature

Jan. 23, 2024

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VTT Technical Research Centre of Finland

Dec. 14, 2023

Materials & Packaging

Alfa Chemistry

Oct. 2, 2023

Pr673 1200 X627 (1)

Learning Resources

Top Tips: What to Consider When Selecting a Termination Style for Specific Applications

Feb. 8, 2023

Masterbond Ep4s80

Sponsored

Master Bond EP4S-80

June 1, 2022

Master Bond EP17HTND-CCM

Sponsored

Master Bond EP17HTND-CCM

June 1, 2022

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