Key Features
- Easy to use
- Exceptional toughness
- Excellent bond strength
- NASA low outgassing
Master Bond EP40TC is a two-component, thermally conductive, electrically isolating epoxy for bonding and sealing. It combines convenient processing with superior strength properties after curing. It is a moderate viscosity, flowable system with a forgiving 1 to 1 mix ratio by weight or volume, and a user-friendly working life. EP40TC cures readily at ambient temperatures or more rapidly with heat. The optimum cure schedule is overnight at room temperature followed by 3-5 hours at 125°F to 150°F. The system has no solvents or diluents and offers low shrinkage upon curing.
This epoxy bonds well to a wide range of substrates including metals, ceramics, composites, and many plastics. Most compelling is its exceptionally high shear and peel strength. EP40TC has remarkable toughness as indicated by its high elongation of 60-70%. This translates into the ability to withstand the most rigorous thermal cycling as well as vibration and shock. It is able to transfer heat, without conducting electricity. In fact, the particle size of the filler material is notably small, the largest being 12-14 microns, with an average size of 3-4 microns. This allows for particularly thin bond lines which lowers thermal resistance. EP40TC has good chemical resistance to water, oils, cleaning agents, and fuels. The color of Part A is light gray and Part B is gray. The service temperature range is -100°F to +300°F. EP40TC is an intriguing option in a variety of applications where the profile outline above is desirable. These include high-strength structural bonding, where the parts are subjected to aggressive thermal cycling. Other uses would be as hermetic seals in electronic packaging, in bonding, sealing and high vacuum environments, and bonding in semiconductor and battery applications.