Key Features
- Thermally conductive, electrically insulating
- Ultra fine particle size
- Can cure up to 1/4 inch thick
- High modulus and compressive strength
Master Bond EP4EN-80 is a one-component, low viscosity epoxy mainly for potting applications. Curing is simple and straightforward, 90 minutes at 65°C plus 30 minutes at 80 to 85°C. The working life is 12-24 hours and any leftover material can be returned to the refrigerator for future use.
It has a thermally conductive, electrically insulative filler material with ultra-small particle sizes. This imparts high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing.
EP4EN-80 is primarily for potting and encapsulation up to 1/4 inch thick. It is very low in viscosity and free-flowing. Usually, one-part epoxies are too exothermic to be used in this fashion, but this system is specially formulated for lower heat generation.
EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics, and many plastics. It is electrically isolating and transfers heat very effectively. Also noteworthy are its high modulus and compressive strength. EP4EN-80 can also be used as an adhesive. Because the particles are so small, it can be applied in thicknesses ranging from 10-15 microns. The combination of thin bond lines and thermal conductivity lowers the thermal resistance to 10-20 x 10-6 K•m2/W. This is a big positive in managing heat-related issues. EP4EN-80 will resist waters, oils, and fuels. Its color is gray. The service temperature range is -50°C to +150°C. The fact that this one-part system with curing temperatures not exceeding 85°C, along with the other desirable properties mentioned above, offers an attractive option for small encapsulation applications in microelectronics.